Voice-over-IP (VoIP) Semiconductor Applications News

TranSwitch Corporation Delivers Gigabit-rate, Multi Core Atlanta 2000 Communications Processors

TranSwitch announced its new Atlanta 2000 communications processor product family that offers robust gateway routing, security and VoIP capabilities. >>

STMicroelectronics Introduces First 65nm SPEAr Customizable Chip for Computer Peripherals Applications

STMicroelectronics has announced a new member of its SPEAr® family of configurable System on-Chip ICs. Manufactured in state-of-the-art low-power 65nm process technology, the new SPEAr Basic... >>

Pin For Pin, Micrel Gives Ethernet Customers Higher Throughput Than Ever Before

Micrel has launched the KSZ8851, a single-port embedded controller chip with 8/16/32-bit and SPI host interfaces. The high throughput device is pin compatible with Micrel’s KSZ8841 and... >>

Infineon Introduces World's Highest Integrated VoIP Solution for Next Generation Access Applications

Infineon has introduced the VINETIC-SVIP, a new family of devices developed for next-generation VoIP access applications. By enhancing the mature and field-proven technology currently offered in... >>

Infineon First to Bring Voice-over-WLAN to Low-Cost Mobile Handsets

Infineon Technologies AG (FSE/NYSE: IFX), a leading provider of communication ICs, is the first semiconductor supplier to offer Voice-over-IP functionality for low-cost mobile phones, and enabling... >>

Infineon sets yet another new trend: Lowest-cost mobile phone platform for Internet-based telephony

Infineon has developed a chip platform that takes care of all telephony functions in the GSM network, while the Atheros chip kicks in when data packets are used via a wireless LAN (hotspot or WiFi)... >>

Mindspeed(R) Introduces Industry's First High-Density SS7 Processor with HDLC Support

Mindspeed Technologies, Inc. has announced the industry's first high-density processing solution that enables networking equipment to terminate both data and signaling system 7 (SS7) traffic... >>

New Audio Controller Chip Gives Time-to-Market Edge for Skype Phones and VoIP Peripherals

Winbond Electronics Corporation America has introduced a new highly integrated USB audio controller for the fastest growing area of the VoIP telephony market. The W681308 can be designed in all... >>

Zarlink Voice Echo Canceller Eases Design of Converged Network Equipment

Zarlink Semiconductor Inc. has expanded its VEC (voice echo canceller) product portfolio with a hardware and firmware platform for next-generation telecom equipment that support voice... >>

TEXAS INSTRUMENTS EXPANDS VOICE OVER IP PORTFOLIO WITH NEW ADDITION TO IP PHONE PRODUCT SUITE

Texas Instruments Incorporated has announced its newest IP phone platform, enabling manufacturers to deliver cost effective IP phones for the low-end enterprise, small and medium business (SMB),... >>

SILICON LABORATORIES ANNOUNCES CARRIER GRADE DUAL PROSLIC FOR VOIP EQUIPMENT

Silicon Laboratories Inc. has announced an extension of the ProSLIC® programmable subscriber line interface (SLIC) family, the Si3226 Dual ProSLIC, a fully-integrated dual-channel SLIC and... >>

TEXAS INSTRUMENTS DRIVES HIGH-DEFINITION VOICE ACROSS IP NETWORKS

Texas Instruments Incorporated has announced technology enhancements that redefine its extensive Voice over IP (VoIP) solutions portfolio, driving voice applications even closer to a... >>

ANALOG DEVICES AND GLOBAL IP SOLUTIONS DEBUT SUPPORT OF BLACKFIN PROCESSORS WITH GIPS VOICEENGINE EMBEDDED SOFTWARE

Analog Devices, Inc. announced that Global IP Solutions (GIPS) has ported and optimized its VoiceEngine Embedded software application for the ADI Blackfin® family of processors. GIPS’... >>

SiGe Semiconductor Enables Wireless VoIP in Samsung Wi-Fi Phones

SiGe Semiconductor, Inc. today announced that its Wi-Fi® RF front-end technology enables wireless voice capability in a new line of Wi-Fi phones from Samsung. The new Wi-Fi phones support... >>

Cypress Teams With Winbond To Introduce Demonstration Kit For 2.4-GHz Wireless VoIP Headset With Best-In-Class Range And Performance

Cypress has introduced a demonstration kit for a Voice over Internet Protocol (VoIP) headset. The new CY4638 VoIP Demonstration Kit pairs the best-in-class interference immunity of Cypress's... >>

Realtek and Legerity Announce High-Definition Audio Solution for Phone-Ready PC s

Realtek Semiconductor Corp. and Legerity, Inc., the "V" in VoIP™, today announced a turnkey Phone-Ready PC solution that combines a high-performance 7.1+2 channel High Definition... >>

TEXAS INSTRUMENTS LATEST VOIP SYSTEM-ON-CHIP, SOFTWARE PUTS CUSTOMERS ON FAST-TRACK TO RESIDENTIAL APPLICATIONS

Texas Instruments Incorporated (TI) [NYSE:TXN], announced its latest Voice over Internet Protocol (VoIP) system on a chip, the TNETV1061, providing advanced VoIP and data routing features for the... >>

Infineon's Unique VoIP Processor Revolutionizes IP-Phone Designs, Doubling CPU Performance for Feature Rich Devices with Benchmark Voice Quality

Infineon has announced that its WildPass WLAN network processor system-on-chip (SoC) has been selected by Accton Technology Corporation, the Taiwan-based premier provider of networking and... >>

Blackfin Powers Be Here Corporation Voip Collaboration Phone For Full-Motion Video, Audio And Data Conferencing

Analog Devices, Inc. announced that Be Here Corporation, a venture-funded firm introducing VoIP (Voice-over-IP) collaboration phones that deliver a new paradigm for multi-location meetings,... >>

PMC-Sierra Announces Secure Wired and Wireless VoIP Phone Reference Platform

PMC-Sierra, Inc. (Nasdaq:PMCS) today announced the availability of a Voice over Internet Protocol (VoIP) Phone reference platform that enables Public Switched Telephone Network (PSTN)-like... >>

Nordic Semiconductor Launches the nRF24L01- an Industry First Single Chip 2.4GHz 2Mbit/s Ultra-Low Power and Ultra-Low Cost MultiCeiver Solution

The latest device in Nordic Semiconductors' portfolio of 2.4GHz wireless IC's merges high speed with ultra-low power and cost. The new nRF24L01 will enable ultra-low cost and power... >>

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